Process	Chemical metallisation
	Suitable for high level of electromagnetic shielding of plastics (copper-layer) and for oxidation and abrasion resistance (nickel-layer). It supplies very complicated shapes with very uniform coatings (1.25-2.5 micron thick). Suitable for mass-production. A copper layer and a nickel layer are chemically deposited on a plastic body previously sprayed and etched. This process is very used in the aeronautic, automotive, and electronic fields.
Danish Name	Kemisk metallisering
Category	Surface processes, Plating
Materials	Plastics (substrate) Coatings: Copper Nickel
Typical products	Cellular phone housing
Competing processes	Painting (Ag, Cu, Ni) Electrical-arc spraying (zinc)
References	ARC 3D Siegfrid Schaal GmbH & Co.
Environmen- tal notes	Creation: No use of chromic-sulphoric acid, harmful for the environment. Disposal: Plated plastic parts can be recycled, as metal layers and plastic can be separated.
Additional info	Deposition rate ranges between 10 and 25 micron/h.
Photo	Thomas Nissen (Computer graphics)
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